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UMC
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UMC specializes in providing foundry services for high performance
semiconductor applications. Our core competency lies in our ability to produce high yield
Integrated Circuit (IC) wafers, manufactured on a per-customer basis. We draw our
distinction from industry leading technology such as our 0.15 micron process and copper
interconnect technology. In addition to wafer manufacturing, UMC customers benefit from
services such as extensive IP resources, free-of-charge design libraries, and full
front-end and backend support.
UMC has offices in Taiwan, Japan, Europe, and the United States, with our head marketing
and sales division strategically located in the heart of Silicon Valley, California. We
employ over 7,000 people worldwide and operate a total of 9 wafer fabrication plants
(fabs) in Taiwan and Japan, with a 1999 production total of 1.8 million 8-inch equivalant
wafers.
Research and Development
Technology leadership will continue to be a significant competitive advantage for UMC and
our customers. We have consistently invested heavily in R&D, and we will be the first
foundry in the world to deliver 0.18um, 6 metal Copper interconnect in 2000. UMC ranks
among the top 10 companies worldwide in semiconductor process patents granted in the USA. |
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Contact us:
Address: No. 3, Li-Hsin 2nd Road, Science-Based Industrial Park, Hsinchu
City, Taiwan, R.O.C.
Tel: 886-3-578-2258 Fax: 886-3-577-9392
Email: foundry@umc.com
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